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SBC-3.5-RV1000

SECO

Price on request

Product number: SBC-3.5-RV1000

Product information "SBC-3.5-RV1000"

SECO SBC-3.5-RV1000 - 3.5" SBC Single-Board-Computer 3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)

SECO SBC-3.5-RV1000 - 3.5" SBC Single-Board-Computer
3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)

Overview

Key Features	Supported CPUs
AMD Ryzen Embedded V1000 and R1000 processors AMD Radeon Vega GPU with up to 11 Compute Units 2x GbE, M.2 WWAN and WLAN slots, 2x USB3.0, 2x USB 2.0, 8x GPI/Os Two DDR4 SO-DIMM Slots supporting DDR4 3200/2400 ECC and non-ECC Memory	AMD Ryzen™ Embedded V1000 family SoCs: AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W AMD Ryzen™ Embedded V1605B with GPU AMD Radeon™ Vega 8, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25 AMD Ryzen™ Embedded V1202B with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W AMD Ryzen™ Embedded R1000 family SoCs: AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W

Key Features

Supported CPUs

AMD Ryzen Embedded V1000 and R1000 processors
AMD Radeon Vega GPU with up to 11 Compute Units
2x GbE, M.2 WWAN and WLAN slots, 2x USB3.0, 2x USB 2.0, 8x GPI/Os
Two DDR4 SO-DIMM Slots supporting DDR4 3200/2400 ECC and non-ECC Memory

AMD Ryzen™ Embedded V1000 family SoCs:
AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1605B with GPU AMD Radeon™ Vega 8, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25
AMD Ryzen™ Embedded V1202B with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W

AMD Ryzen™ Embedded R1000 family SoCs:
AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W

Specification

Description	Full connectivity on powerful AMD Ryzen™ platform
Cpu	AMD Ryzen™ Embedded V1000 family SoCs: AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W AMD Ryzen™ Embedded V1605B with GPU AMD Radeon™ Vega 8, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25 AMD Ryzen™ Embedded V1202B with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W AMD Ryzen™ Embedded R1000 family SoCs: AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W
Max Cores	4
Memory	2x DDR4 ECC and non-ECC SODIMM Slots Support DDR4-2400 memories (DDR4-3200 with V1807B and V1756B), up to 32GB total
Graphics	GPU AMD Radeon™ VEGA with up to 11 Compute Units DirectX® 12 supported H.265 (10-bit) decode and 8-bit video encode VP9 decode 4 independent displays supported (3 with R1000 SoCs)
Video Interfaces	4x DP++ connectors (only 3 working with R1000 SoCs)
Video Resolution	DP++: Up to 4096 x 2160
Mass Storage	M.2 NVMe slot (Socket 2 Key M Type 2280), PCI-e x4 interface microSD Card slot (combo with miniSIM slot) 2x SATA 7p M connectors w/ 1x power connector
Networking	Up to 2 x Gigabit Ethernet ports M.2 WWAN slot (Socket 2 Key B Type 2242/3042) for Modems M.2 Connectivity Slot (Socket 1 Key E Type 2230)
Usb	2 x USB 3.0 Host ports on USB 3.0 Type-A sockets 2 x USB 2.0 Host ports on internal pin header 1 x USB 3.0 (V1000 SoCs) / USB 2.0 (R1000 SoCs) Host port on WWAN M.2 slot 1 x USB 2.0 Host port on M.2 Connectivity Slot
Pci	1 x PCI-e x4 port on M.2 NVMe Slot 1 x PCI-e x1 port on M.2 WWAN Slot 1 x PCI-e x1 port on M.2 Connectivity Slot 2x PCI-e x1 on Gigabit Ethernet Controllers
Audio	HD Audio codec Line Out + Microphone + S/PDIF Out interfaces on internal pin header
Serial Ports	2 x RS-232/RS-422/RS-485 UARTS, on internal Pin Header
Other Interfaces	miniSIM slot for M.2 modems (combo with microSD slot) 8 x GPI/Os connector FAN connector Switch / LED Front Header connector 2x I2C on internal pin header Antitamper connector Optional TPM 1.2 or 2.0 onboard
Power Supply	+12VDC÷ +24VDC RTC battery
Operating System	Microsoft® Windows 10 (64-bit) Linux
Operating Temperature	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version, only for future SoCs in extended temperature range and with TDP ≤25W)) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	146x102 mm

Product Variants / Accessories

SC90-2000-1312-C1-V_	SBC-C90 w/ AMD Ryzen Embedded V1605B @ 2.0GHz 15W, Horizontal power conn, TPM 2.0, 2x GbE (I211), 4-wire fan - Comm.Temp
SC90-4000-1312-C1-V	SBC-C90 w/ AMD Ryzen Embedded V1807B @ 3.35GHz 45W, Horizontal power conn, TPM 2.0, 2x GbE (I210), 3-wire fan - Comm. Temp
SC90-7000-1312-I1-V	SBC-C90 w/ AMD Ryzen Embedded V1404I @ 2.0GHz 15W, Horizontal power conn, TPM 2.0, 2x GbE (I210), 4-wire fan, Ind. Temp
SC90-8000-1312-C1-V	SBC-C90 w/ AMD Ryzen Embedded R1305G @ 1,5GHz 8W, Horizontal power conn, TPM 2.0, 2x GbE (I211), 4-wire fan - Comm. Temp

All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SBC-3.5-RV1000
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

OEM System Integration Support

We would be happy to assist you in selecting the optimal hardware platform for your application.

If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.

You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.

^{Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.}

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.

Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.